Guiding fin heat sink

ABSTRACT

The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained.

FIELD OF THE INVENTION

The present invention relates to a heat sink and its method thereof; more particularly, relates to a guiding fin heat sink and its method where heat generated by a CPU can be directly dissipated out from the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency.

DESCRIPTION OF THE RELATED ART

A heat sink according to a prior art, as shown in FIG. 5, comprises a heat-dissipation unit and a fan thereon. The heat-dissipation unit comprises a base and a plurality of fins extended up from the base. When utilizing, the base is stuck on a CPU of a main board so that heat generated by the CPU on operating is transmitted to the fins through the base; an air flow is directed to the fins to carry out the heat; and then, the air flow with the heat is absorbed by another fan on the computer case to be flown out for heat dissipation.

The above heat sink according to the prior art utilizes a fan to guide an air flow to the fins for heat dissipation. But, because the air flow is directly directed to the base and the fins by the fan, when the air flow with heat is flown from between the fins, the air flow with heat will be remained in the computer case. And, because the another fan on the computer case is far from the heat-dissipation device on the main board, when the air flow with heat is not yet absorbed and blown out of the computer case by the another fan on the computer case, the air flow with heat will be directly directed to the base and the fins so that a heat recycling and bad heat-dissipation efficiency occurs.

SUMMARY OF THE INVENTION

Therefore, the main purpose of the present invention is that: absorbing heat generated by a CPU through a base and guiding it to a heat-dissipation unit and more than one heat pipe; and dissipating the heat in the heat-dissipation unit and the heat pipe out to the outside of a computer case, to prevent from heat re-cycling in the computer case and to achieve better heat dissipation efficiency.

In order to achieve the above purpose, the present invention is a guiding fin heat sink and a method thereof, where the sink comprises a base, a heat-dissipation unit deposed on a surface of the base, more than one heat pipe deposed between the base and the heat-dissipation unit, and a fan on an end-surface at a side of the heat-dissipation unit; and the method comprises the following steps:

(a) obtaining a heat-dissipation unit which is deposed on a CPU of a main board by a base

(b) Corresponding more than one guiding channel of the heat-dissipation unit to an opening on a side wall of a computer case; and

(c) Deposing a fan on the opening of the computer case, where, after absorbing heat generated by the CPU through the base, the heat is directly directed out of the computer case by the fan.

Accordingly, the heat generated by the CPU can be absorbed by the base to be directed to the heat-dissipation unit and the heat pipe and then to be directly directed out of the computer case by the fan.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be better understood from the following detailed descriptions of the preferred embodiments according to the present invention, taken in conjunction with the accompanying drawings, in which

FIG. 1 is a perspective view according to a first embodiment of the present invention;

FIG. 2 is a top view according to the first embodiment of the present invention;

FIG. 3A is a view showing a status of use according to the first embodiment of the present invention;

FIG. 3B is a view showing a status of use according to a second embodiment of the present invention;

FIG. 4 is a view showing a status of use according to a third embodiment of the present invention; and

FIG. 5 is a perspective view according to a prior art.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following descriptions of the preferred embodiments are provided to understand the features and the structures of the present invention.

Please refer to FIG. 1 through FIG. 4, which are a perspective view, a top view, and a view showing a status of use, according to the first embodiment of the present invention; and views showing a status of use according to a second embodiment and a third embodiment of the present invention. As shown in the figures, the present invention is a guiding fin heat sink, comprising a base 1, a heat-dissipation unit 2, more than one heat pipe 3 and a fan 4, where heat absorbed by the base 1 can be transmitted to the heat-dissipation unit 2 and the heat pipe 3 and then can be directly directed out of a computer case by the fan 4.

The base 1 can be made of alumni, copper, alumni alloy or copper alloy which has better heat dissipation efficiency.

The heat-dissipation unit 2, made of alumni, copper, alumni alloy or copper alloy with better heat dissipation efficiency, is deposed on a surface of the base 1, comprising a curved surface opposite to the surface contacting the base 1; more than one guiding channel 23 passing through at least two end surfaces of said heat-dissipation unit 2; a first 21 and a second 22 heat-dissipating parts with a plurality of fins 211,221; and more than one slanting part 24,25 extending from two ends of the first 21 and the second 22 heat-dissipating parts while the slanting parts 24,25 are slanted opposite to each neighboring other.

An end of the heat pipe 3 is located between the base 1 and the heat-dissipation unit 2 while the other end is made penetrating through the guiding channels 23. The heat pipe 3 can be curved in a ‘U’ shape; can be a pipe filled with liquid inside while producing capillary attraction; or can be a circuit-type pipe.

The fan 4 is deposed on an end surface of the heat-dissipation unit 2 or an opening of a computer case.

By the above structure, a guiding fin heat sink is obtained.

A heat-dissipating method using the above guiding fin heat sink comprises the following steps:

(a) Obtain a base made of alumni, copper, alumni alloy or copper alloy which has better heat dissipation efficiency. The base 1 is stuck on a CPU 51 of a main board 5 (as shown in FIG. 3A).

(b) Depose a heat-dissipation unit 2 on the opposite surface of the base 1 to the CPU 51, which is made of a material with better heat-dissipation efficiency like alumni, copper, alumni alloy or copper alloy. The heat-dissipation unit 2 comprises more than one guiding channel 23 passing through at least two end surfaces of the heat-dissipation unit 2. The heat-dissipation unit 2 consists of a first 21 and a second 22 heat-dissipating parts of a plurality of fins 211,221. More than one slanting part 24,25 extends from two ends of the first 21 and the second 22 heat-dissipating parts, where the slanting parts 24,25 are slanted opposite to each neighboring other. And, more than one heat pipe 3 is deposed between the base 1 and the heat-dissipation unit 2 with one end; and the other end is made penetrating through the more than one guiding channel of the heat-dissipation unit 2. So, the heat pipe can be curved in a ‘U’ shape. The heat pipe 3 can be a pipe filled with liquid inside while producing capillary attraction; or can be a circuit-type pipe. And, an end of the more than one guiding channel is corresponding to an opening (not shown in the figures) of a side wall of the computer case.

(c) A fan is deposed between the opening of the computer case and an end surface of the more than one guiding channel (as shown in FIG. 3A) so that, after heat generated by the CPU is absorbed by the base 1, the heat directed to the heat-dissipation unit 2 and the heat pipe 3 is then directed out to the outside of the computer case 6 through the opening.

The fan can not only be deposed between the opening of the computer case and the heat-dissipation unit but also can be deposed outside of the opening of the computer case (as shown in FIG. 3B), so that, after heat generated by the CPU is absorbed by the base 1 and then is directed to the heat-dissipation unit 2 and the heat pipe 3, an air flow is directed into the guiding channel by the fan to make the heat be directly carried out of the computer case 6 through the opening.

Or, one can also make an end of the more than one guiding channel corresponding to the opening of the computer case and depose the fan on the opposite end surface of the guiding channel, so that, after heat generated by the CPU is absorbed by the base 1 and then is directed to the heat-dissipation unit 2 and the heat pipe 3, an air flow is directed into the guiding channel by the fan to make the heat be directly carried out of the computer case 6 through the opening.

To sum up, the present invention is a guiding fin heat sink, where heat generated by a CPU is directly dissipated out to the outside of the computer case to prevent from heat recycling and to obtain better heat-dissipation efficiency.

The preferred embodiments herein disclosed are not intended to unnecessarily limit the scope of the invention. Therefore, simple modifications or variations belonging to the equivalent of the scope of the claims and the instructions disclosed herein for a patent are all within the scope of the present invention. 

1. A guiding fin heat sink, comprising: a base; a heat-dissipation unit deposed on a surface of said base, having a curved end surface which is opposite to an end surface stuck on said surface of said base, and more than one guiding channel which is made passing through at least two other end surfaces of said heat-dissipation unit; more than one heat pipe, having one end which is deposed between said base and said heat-dissipation unit, and the other end which is made penetrating through said more than one guiding channel; and a fan deposed on an end surface of said heat-dissipation unit.
 2. The heat sink according to claim 1, wherein said base is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
 3. The heat sink according to claim 1, wherein said heat-dissipation unit comprises a first heat-dissipating part and a second heat-dissipating part; and wherein more than one slanting part is located at each of two ends of said first heat-dissipating part and said second heat-dissipating part and is extended out each of two ends of said guiding channel.
 4. The heat sink according to claim 3, wherein each of said slanting part of said first heat-dissipating part and said second heat-dissipating part is slanted opposite to each neighboring other.
 5. The heat sink according to claim 3, wherein said first heat-dissipating part and said second heat-dissipating part comprises a plurality of heat-dissipating fins.
 6. The heat sink according to claim 1, wherein said heat-dissipation unit is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
 7. The heat sink according to claim 1, wherein said heat pipe is curved in a ‘U’ shape.
 8. The heat sink according to claim 1, wherein said heat pipe is a pipe filled with liquid inside while producing capillary attraction.
 9. The heat sink according to claim 1, wherein said heat pipe is a circuit-type pipe.
 10. A heat-dissipating method using a guiding fin heat sink, comprising the following steps: (a) Obtaining a heat-dissipation unit to be deposed on a CPU of a main board by a base; (b) Corresponding an end of more than one guiding channel of said heat-dissipation unit to an opening on a side wall of a computer case; and (c) Deposing a fan on said opening of said computer case, wherein, after absorbing heat generated by said CPU through said base, said heat is directly directed out of said computer case by said fan.
 11. A heat-dissipating method according to claim 10, wherein said base is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
 12. A heat-dissipating method according to claim 10, wherein said heat-dissipation unit comprises a first heat-dissipating part and a second heat-dissipating part; and wherein more than one slanting part is located at each of two ends of said first heat-dissipating part and said second heat-dissipating part and is extended out each of two ends of said guiding channel.
 13. A heat-dissipating method according to claim 10, wherein each of said slanting part of said first heat-dissipating part and said second heat-dissipating part is slanted opposite to each neighboring other.
 14. A heat-dissipating method according to claim 10, wherein said first heat-dissipating part and said second heat-dissipating part comprises a plurality of heat-dissipating fins.
 15. A heat-dissipating method according to claim 10, wherein said heat-dissipation unit is made of which is selected from a group consisting of alumni, copper, alumni alloy and copper alloy.
 16. A heat-dissipating method according to claim 10, wherein more than one heat pipe is deposed between said base and said heat-dissipation unit at one end and the other end is made penetrating through said more than one guiding channel.
 17. A heat-dissipating method according to claim 10, wherein said heat pipe is curved in a ‘U’ shape.
 18. A heat-dissipating method according to claim 10, wherein said heat pipe is a pipe filled with liquid inside while producing capillary attraction.
 19. A heat-dissipating method according to claim 10, wherein said heat pipe is a circuit-type pipe.
 20. A heat-dissipating method according to claim 10, wherein said step (c) is corresponding an end of said guiding channel to an opening of said computer case; deposing a fan at an opposite end of said guiding channel; and, after heat generated by CPU is absorbed by said base, guiding an air flow into said guiding channel to make said heat be directly carried out of said computer case. 